Rosin flux is used to facilitate soldering. It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds. It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process.
Specifications Viscosity: 1（Pa·S） Granularity: 1（um） Neutral PH: 7土0.3
Features .Few residues, no need to clean .Excellent solderability. .IC and PCB are not corrosive .Stable performance and low volatility .No irritating smell, safe and reliable .Strong insulation, smooth welding surface .Suitable for mobile phone, PC card BGA precision electronic chip level during welding process.